Component Assembly Service

What we mean by “Component Assembly”

In our scope, component assembly covers everything from kitted subassemblies (mechanical, plastic, cable/harness) to complete box builds that combine mechanical parts, PCBAs, wiring and firmware into a ready-to-use unit. “Box build” is the industry term for delivering a complete electronics assembly inside its enclosure—beyond PCB soldering and into final system integration.

Why BACH INDUSTRY AG

• One partner, multiple processes. Machined, molded, formed, printed, wired, tested, and packed under one coordinated program—prototype → pilot → series.

• Quality you can audit. Workflows aligned to ISO 9001; sector add-ons (e.g., ISO 13485 for medical) are available via certified lines/partners when required. ISO 13485 governs medical device manufacturing and assembly controls.

• Standards-driven workmanship. PCB assemblies to IPC-A-610 acceptance; cables/wire harnesses to IPC/WHMA-A-620 (Class 2/3 as specified).

• Traceability & documentation. From BOM and revision control to inspection reports and material certs (EN 10204 3.1).

• EU logistics, Swiss rigor. DACH coverage, customs paperwork (HS/EORI), and Incoterms EXW/FCA/DAP/DDP.

What we assemble

Mechanical subassemblies

• CNC-machined housings, brackets, heat sinks, shafts, spacers, pressed/bushed features

• Sheet-metal frames, chassis, brackets, busbars, shielding cans (laser/waterjet + CNC bend + weld)

• Plastics & elastomers: injection-molded parts (soft/bridge tooling), insert/overmold, thermoformed covers, urethane/RTV cast parts

• Hardware integration: PEM/clinch, threaded inserts (heat-set/ultrasonic), helicoils, precision fastening with torque programs

Electrical & electromechanical assemblies

• Cable & wire harnesses to IPC/WHMA-A-620: crimp, solder, IDC, braiding/lacing, labeling, 100% continuity test, hipot as needed.

• PCBAs + mechanics: standoffs, gaskets, EMI shielding, fans/heatsinks, displays, keypads, sensors, motors, encoders

• Box builds / system integration: final enclosure assembly, firmware load, functional test, serialization, and packaging for shipment to line or end user.

Processes we coordinate

• Machining: 3- & 5-axis CNC milling, turning (incl. Swiss), EDM (wire/sinker), grinding

• Sheet metal: laser/waterjet cutting, CNC bending, stamping, deep drawing, TIG/MIG/spot welding

• Molding & casting: injection molding (single/two-shot, overmold), compression molding, die casting, urethane/RTV

• Additive: DMLS/SLM (metal), SLS/MJF (nylon), SLA/DLP (resin) for fixtures, ducts, housings

• Finishing: anodize (II/III), passivation, Zn/Ni/EN plating, powder coat/paint, bead blast, brushing, polishing, heat treatment, nitriding/carburizing, laser marking

• Electrics: crimping to spec, selective solder, conformal coat/potting, harness overmold, EMI/EMC shielding

Materials we handle

• Metals: Al 6061/7075/5083, stainless 304/316L/17-4PH, tool steels (H13/A2/D2), carbon/mild steels, Ti Gr2/Gr5, Inconel 625/718, Cu/Br/Brz, Zn, Mg

• Polymers: ABS, PC/ABS, PA6/PA12 (GF), POM, PMMA, PETG, PBT, PEEK, PEI (Ultem), PPS/PPSU, PTFE, PVDF, HDPE/PP, TPE/TPU, silicone/EPDM/NBR

• Composites: CFRP/GFRP laminates, honeycomb panels, carbon tubes with embedded inserts

Quality, inspection & test

• Workmanship standards: PCBAs to IPC-A-610; harnesses to IPC/WHMA-A-620—the consensus requirements for cable/wire assemblies.

• Incoming & in-process controls: kitting checks, ESD controls, torque programs, poka-yoke fixtures, first-article approval

• Metrology & inspection: CMM, optical/vision, 3D/blue-light scan, CT for internal features; ballooned drawings, FAIR/FAI

• Electrical tests: continuity, insulation resistance/hipot, functional test (FCT), burn-in, firmware flashing

• Traceability: lot/serial tracking, traveler packets, and EN 10204 3.1 material certificates when applicable.

Documentation deliverables

• BOM with approved alternates, revision history (ECR/ECO)

• Assembly drawings, wiring schematics, torque charts, test plans

• Inspection records (FAI/FAIR, ISIR), capability data (SPC/Cpk where requested)

• Certificates: material 3.1, RoHS/REACH, CoC; sector documentation on request (PPAP levels 1–3)

Cleanliness & environment

• ESD-safe assembly lines and packaging as standard.

• White-room / cleanroom assembly for sensitive or medical products can be scheduled via ISO 13485 lines (Class 7/8 options through partners).

Packaging, labeling & logistics

• Work-order kitting, subassembly cell packs, foam/tray protection

• Barcode/QR serialization, UDI (on request), ESD/Moisture Barrier Bags

• EU customs paperwork (HS/EORI), Incoterms EXW/FCA/DAP/DDP; consolidated shipments and buffer stock options

Typical engagements

• PCBA + harness + enclosure box build with firmware load, FCT, and serialized labeling (Class 2/3 workmanship per IPC)

• Mechatronic subassembly: motor-gearbox-encoder module with precision brackets, torque-controlled fastening, and end-of-line functional test

• Shielded chassis: sheet-metal frame with busbars, EMI gaskets, and harness routing to IPC/WHMA-A-620

• Medical pilot build: controlled-environment assembly with documentation set aligned to ISO 13485 expectations (DHF/Device Master Records supplied by customer)

How we work

1. Technical package — Send STEP + PDFs (with GD&T), BOM, schematics/wire tables, test plan, target quantities/EAU, and required standards (IPC class, 620 class, cleanliness).

2. DFM/industrialization — We return manufacturability notes, risk register, fixture ideas, and cost/lead options (standard vs. expedite).

3. Pilot & validation — T0/T1 builds, FAI/FAIR, functional test correlation; packaging and labeling specs are frozen.

4. Release & supply — Blanket POs with call-offs, Kanban/VMI, EDI/MRP integration, agreed change-control (ECR/ECO) and traceability level.

RFQ checklist (faster quotes) {#rfq}

• Assembly scope (subassembly vs. box build), IPC class (610/620) and compliance needs

• BOM with approved alternates; key part lead times/allocations

• Drawings & 3D (STEP, DWG/DXF), wiring tables, schematics, connector pinouts

• Test requirements (continuity/hipot/FCT/burn-in), firmware versioning

• Traceability depth and certificates (e.g., EN 10204 3.1)

• Packaging, serialization/labeling (UDI if any), shipping terms and destinations